RAK3172 Breakout Board RAK3272S

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers. Its firmware is based on RAKwireless Unified Interface V3 (RUI3) that allows you create different functionalities using RUI APIs.

For the antenna connection the breakout board has a RP-SMA female connector.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, it has Ultra-Low Power Consumption of 1.69uA in sleep mode

This module complies with Class A, B & C of LoRaWAN 1.0.4 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you implement your own customized long-range LoRa network quickly.