RAK3172 LoRaWAN Module Internal Card
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The LoRaWAN Internal Module based on the RAK3172 chipset is a compact and powerful wireless communication solution for long-range, low-power IoT applications. Built on the STM32WLE5 SoC, it supports LoRaWAN Class A, B, and C with transmission power up to +22 dBm. Designed for regional frequency compatibility and external antenna use, it ensures reliable and efficient connectivity.
وحدة LoRaWAN داخلية تعتمد على شريحة RAK3172 هي حل اتصال لاسلكي مدمج لتطبيقات إنترنت الأشياء بعيدة المدى ومنخفضة الطاقة. تعمل بمعالج STM32WLE5 وتدعم LoRaWAN الفئات A وB وC بقدرة إرسال تصل إلى +22 dBm، مع دعم هوائي خارجي وترددات حسب المنطقة.
The LoRaWAN Internal Module featuring the RAK3172 chipset is designed to deliver robust, long-range wireless communication for modern IoT deployments. Powered by the STM32WLE5 System-on-Chip, it integrates a low-power microcontroller with a LoRa transceiver, reducing system complexity and power consumption.
Supporting LoRaWAN Class A, B, and C, the module offers flexibility for different network and power-use scenarios. With a transmission power of up to +22 dBm and region-dependent frequency support, it ensures stable connectivity across diverse geographic locations.
The module is designed for use with an external antenna, enhancing signal strength and range. Its compact internal-card form factor makes it ideal for embedded systems, smart sensors, industrial monitoring, and smart city applications.
Specifications
Module Type: LoRaWAN Internal Card
Chipset: RAK3172
SoC: STM32WLE5
LoRaWAN Classes: A / B / C
TX Power: Up to +22 dBm
Frequency Band: Region-dependent
Antenna Interface: External Antenna
Communication Type: Long-range, low-power wireless