0.6mm High Purity Solder Wire 63sn-37pb flux 1.2% MY-1016-0.6mm
High Purity 0.6mm Solder Wire (63% Tin / 37% Lead) with 1.2% MY-1016 rosin core flux is designed for precise and efficient soldering. Its low-melting-point formula reduces heat stress on electronic components while providing fast tinning and excellent wettability for strong, reliable joints. The advanced rosin core ensures smooth solder flow, minimal spatter, low smoke, and light odor during use. This solder wire produces bright, clean joints with low residue and strong oxidation resistance. Ideal for electronics repair, PCB assembly, and delicate soldering tasks where accuracy, stability, and consistent welding performance are required.
سلك لحام عالي النقاء بقطر 0.6 مم بنسبة 63% قصدير و37% رصاص مع قلب فلكس MY-1016 بنسبة 1.2% مصمم لأعمال اللحام الدقيقة والفعالة. يتميز بدرجة انصهار منخفضة تقلل تأثير الحرارة على المكونات الإلكترونية، مع سرعة في تكوين طبقة القصدير وقابلية بلل ممتازة لضمان وصلات لحام قوية وموثوقة. يحتوي على قلب فلكس متطور يضمن تدفقًا سلسًا مع تقليل التناثر والدخان وبقايا اللحام. ينتج نقاط لحام لامعة ونظيفة مع مقاومة جيدة للأكسدة، مما يجعله مناسبًا لإصلاح الإلكترونيات وتجميع لوحات الدوائر المطبوعة والأعمال الدقيقة.
The 0.6mm High Purity Solder Wire with a 63% tin and 37% lead alloy is engineered for professional and precision soldering applications. The eutectic Sn63/Pb37 composition provides a stable low melting point that allows the solder to transition quickly from solid to liquid, minimizing heat exposure to sensitive electronic components.
Equipped with a 1.2% MY-1016 rosin core flux, the solder wire ensures fast tinning and excellent wettability, allowing the solder to flow smoothly and bond effectively with metals. This improves soldering efficiency and reduces the risk of weak or unreliable connections.
The high-purity alloy produces bright, smooth solder joints without bubbles or cracks while maintaining excellent conductivity and mechanical strength. The advanced rosin core formula generates less smoke, a mild odor, and minimal residue, making the soldering process cleaner and more comfortable.
This solder wire is ideal for PCB soldering, electronics repair, and precision assembly work where reliable performance and consistent solder joints are required.
Specifications
Product Type: Solder Wire
Alloy Composition: 63% Tin (Sn) / 37% Lead (Pb)
Wire Diameter: 0.6 mm
Flux Type: Rosin Core MY-1016
Flux Content: 1.2%
Melting Point: Approximately 183°C
Purity: High Purity Alloy
Residue: Low Residue
Smoke Level: Low Smoke
Oxidation Resistance: High
Surface Finish: Bright and smooth solder joints
Applications
Electronic circuit soldering
PCB assembly and repair
Mobile phone and computer repair
Precision electronic components
DIY electronics projects
Maintenance and technical workshops
Fine soldering tasks requiring small diameter wire