BGA SMD Soldering Paste Flux Grease10cc, RMA-223
RMA-223 BGA SMD Soldering Paste Flux Grease (10cc) is a high-quality no-clean flux designed for professional soldering, rework, and repair applications. Formulated with premium resin-based flux, it provides excellent wetting performance, strong adhesion, and smooth solder flow for reliable solder joints. The low-residue formulation minimizes cleaning requirements and reduces smoke generation during soldering. Ideal for BGA, PGA, SMD, and PCB rework, the RMA-223 flux improves soldering efficiency while helping prevent solder ball formation. Its convenient 10cc syringe packaging allows precise application, making it suitable for electronics repair, manufacturing, and prototyping.
معجون الفلكس RMA-223 BGA SMD بسعة 10cc هو فلكس عالي الجودة من نوع No-Clean مصمم لأعمال اللحام الاحترافية وإعادة العمل وإصلاح اللوحات الإلكترونية. يتميز بقدرة ممتازة على ترطيب الأسطح وتحسين تدفق القصدير وتكوين نقاط لحام قوية ولامعة. تقلل تركيبته منخفضة البقايا من الحاجة إلى التنظيف بعد الاستخدام وتحد من انبعاث الدخان أثناء عملية اللحام. يُستخدم بشكل واسع في أعمال إصلاح وإعادة لحام مكونات BGA وPGA وSMD والدوائر المطبوعة (PCB)، كما يتيح تصميم الحقنة سعة 10cc تطبيقًا دقيقًا وسهلاً للفلكس.
The RMA-223-UV Soldering Flux Paste is a professional-grade no-clean flux specifically developed for precision soldering and rework operations involving modern electronic components. The formulation consists of a homogeneous mixture of high-quality resin flux and specialized gelling additives that maintain consistency and prevent separation during storage and use.
This flux provides excellent wetting characteristics, ensuring rapid solder flow and strong bonding between solder and component leads. The carefully balanced formulation minimizes solder ball formation while producing bright and reliable solder joints.
The RMA-223 leaves only a small amount of light-colored residue after soldering, eliminating the need for post-solder cleaning in most applications. Its high insulation resistance helps reduce electrical interference, making it suitable for sensitive electronic devices such as smartphones, communication equipment, and precision electronics.
Packaged in a convenient 10cc syringe, the flux can be applied accurately to small soldering areas, making it ideal for component replacement, PCB repair, BGA reballing, and SMD assembly processes.
Specifications
| Specification | Details |
|---|---|
| Model | RMA-223-UV |
| Product Type | No-Clean Soldering Flux Paste |
| Volume | 10cc |
| Flux Type | Mildly Activated Rosin (RMA) |
| Standard Compliance | ANSI/J-STD-004-006 |
| Residue Type | Low Residue |
| Cleaning Required | No |
| Color of Residue | Light Amber |
| Application Method | Syringe Dispensing |
| Viscosity | High |
| Wetting Performance | Excellent |
| Insulation Resistance | High SIR Value |
| Suitable For | BGA, PGA, SMD, PCB Rework |
Applications
- BGA rework and reballing
- SMD component soldering and repair
- PCB assembly and maintenance
- Mobile phone motherboard repair
- Laptop and computer motherboard repair
- PGA component installation
- Electronics prototyping
- Communication equipment repair
- Precision electronic assembly
- Industrial electronics maintenance
- Surface-mount device rework
- Microelectronics soldering applications