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2.4G CC2530F256 Zigbee Intelligent Home Networking Wireless Module with SMD Type IPEX Antenna Interface CC2530

5.0(1 review)
SKU: ME-3589
JD10.00

The 2.4G CC2530 ZigBee Wireless Networking Module is a compact and powerful solution for implementing ZigBee-based communication in IoT and embedded systems. Based on the Texas Instruments CC2530 SoC, it combines an IEEE 802.15.4-compliant radio transceiver with an 8051 microcontroller core, enabling developers to create low-power mesh networks. This module is ideal for applications requiring reliable short-range wireless communication with support for multi-hop routing and ZigBee protocol stacks (Z-Stack, etc.). It can be used as a coordinator, router, or end device and is widely supported by development environments and open-source ZigBee stacks.

Zigbee & Xbee

CE FCC Certificated CC2530 Zigbee Module for Smart Home


T30P127F2.4G is a tiny volume integrated 2.4GHz zigbee wireless rf module,which was based on TI CC2530 Zigbee RF chip technology, adopted standard IEEE 802.15.4 protocol. its data maximum transfer distance up to more than 390 meters, can be widely used into the following applications:

              • Industrial Control and Data Monitoring                      • Environmental and Health Monitoring
              • Home Automation, Entertainment and Toys              • Security, Location and Asset Tracking
              • Emergency and Disaster Response                              • Military/Battlefield Applications  

 PRODUCT CHARACTERS:  

1, Tiny Volume SMD Design

Module size 14.6mm*20.45mm*2.7mm 
2,Immersion Gold
Provide a best SMD Performance 

3, Original Chips
TI,Murata,Epson Orginal Chips Assurance
4, Pre-Programmed Optional
Mostly shorten the time of developing new products

TECHNICAL PARAMETERS:
No.
Parameter Name
Parameter Value
Summary
1
RF IC
CC2530
TI
2
Module Size
14.6mm*20.45mm*2.7mm
Including IPEX
3
Module Weight
1.2mg
Including IPEX
4
Working Frequency
2405~2480MHz
2.4GHz, IEEE 802.15.4 Protocol
5
Craft
Immersion gold
SMT，ROHS
6
Interface Mode
3*8*1.27mm Pitch
SMD
7
Supply Power
2.0~3.6V DC
Caution:Causing permanent damage to the module when the voltage is higher than 3.6V.
8
Communication Level
+0.7V~+5V
9
Actual Test Communication Distance
≈390m
Test Condition:
10
Air Ratio
250Kbps
Weather:Sunny, 35℃;Relative Humidity:65%;
11
Send Power
4dBm
Test location:Open space;
12
Shut Current
1.2uA
Antenna Gain:3DB; Height:2m;Speed Rate:250K.
13
Send Current
28mA@4dBm
14
Receive Current
27mA
About 2.5mW
15
Communication Interface
I/O
MCU sleep，wireless shut，Voltage:3.3V
16
Send Length
1~103Bytes
Power supply must exceed 100mA
17
Receive Length
1~103Bytes
Average current
18
RSSI Support
Support
All I/O pins of MCU, please see IC manual for detail.
19
Antenna Interface
IPEX
Single data packet
20
Working Temperature
-40℃~+85℃
Single data packet
21
Relative Humidity
10%~90%
Please see IC manual.
22
Storage Temperature
-40~+125℃
Antenna external
23
Receive Sensitivities
97dBm@250Kbps
Industrial grade
ZIGBEE PCB MODULE LAYOUT:
MIN
MAX
Units
A
14.6
14.6
mm
B
20.45
20.45
mm
C
2.7
2.7
mm
D
0.8
0.8
mm
E
1.27
1.27
mm
F
3.1
3.1
mm
G
2.3.
2.3
mm

 PIN DEFINITION: 

PIN Number
PIN Name
PIN Direction
PIN Applications
1
GND
1~103Bytes
Grounding,joint with the reference point of power.
2
VCC
Support
Supply power：2.0~3.6V.
3
P2.2
I/O
Single -Chip IO
4
P2.1
I/O
Single -Chip IO
5
P2.0
I/O
Single -Chip IO
6
P1.7
I/O
Single -Chip IO
7
P1.6
I/O
Single -Chip IO
8
NC

Dangling
9
NC

Dangling
10
P1.5
I/O
Single -Chip IO
11
P1.4
I/O
Single -Chip IO
12
P1.3
I/O
Single -Chip IO
13
P1.2
I/O
Single -Chip IO
14
P1.1
I/O
Single -Chip IO
15
P1.0
I/O
Single -Chip IO
16
P0.7
I/O
Single -Chip IO
17
P0.6
I/O
Single -Chip IO
18
P0.5
I/O
Single -Chip IO
19
P0.4
I/O
Single -Chip IO
20
P0.3
I/O
Single -Chip IO
21
P0.2
I/O
Single -Chip IO
22
P0.1
I/O
Single -Chip IO
23
P0.0
I/O
Single -Chip IO
24
RSET
Input
Reset interface
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