Description:

• Excellent wetting and high reliability.
• Can effectively prevent the collapse of the printing and preheat.
• Viscous force lasting, not easy to dry.

Features:

• Excellent wetting and high reliability.
• Can effectively prevent the collapse of the printing and preheat.
• Viscous force lasting, not easy to dry.
• Colorless, does not affect the test, fine-clean and cleaning performance.
• White and plump solder joint.
• No false welding, strong adhesive with solder iron tip.
• Products wetting, anti-dry and strong, long shelf life at room temperature.
• Suitable for: mobile phone repair industry, computer digital service industries.
• Used to high-precision circuit board soldering SMT, BGA soldering processes, etc.